TAI · —

Kinsus Interconnect Technology Corp. (3189.TW) Stock

$862.00 +3.11% TAI: 3189.TW

Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments.

Valuation

MetricValue
Price$862.00
Market Cap
P/E Ratio
P/B Ratio
P/S Ratio
EPS (TTM)
52-Week High$939.00
52-Week Low$101.50
Dividend Yield

Financials & Margins

MetricValue
ROE
ROA
ROCE
Gross Margin
Operating Margin
Net Margin
Debt/Equity
Current Ratio

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Valuation & Return Ratios

MetricValue
PEG Ratio
EV / EBITDA
FCF Yield
Quick Ratio
Interest Coverage
Return 1Y738.33%
Return 3Y769.46%
Return 5Y

Peer Comparison

TickerPriceChangeP/EMarket CapDiv Yield
2337.TWMacronix International Co., Ltd. $137.00 +2.62% 0.00%
3260.TWOADATA Technology Co., Ltd. $402.00 -2.19% 0.00%
4966.TWOParade Technologies, Ltd. $570.00 -5.00% 0.00%
5434.TWTopco Scientific Co.,Ltd. $521.00 +1.36% 0.00%
6176.TWRadiant Opto-Electronics Corporation $81.30 -3.56% 0.00%

About Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.

Kinsus Interconnect Technology Corp. is led by CEO Hsu Chen, employs 5,910 people, headquartered in Taoyuan City, TW, publicly traded since 2004.

over the past 52 weeks the stock has ranged between $101.50 and $939.00, and currently trades 8.2% below its 52-week high.

Official website: www.kinsus.com.tw

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